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About this paper
Eneko Osaba, Esther Villar-Rodriguez, Sebastián V. Romero
Researchers at TECNALIA developed a benchmark dataset and an instance generator for Real-World Three-Dimensional Bin Packing Problems (3dBPP), designed to be compatible with current quantum computing hardware. This resource, named Q4RealBPP-DataGen, incorporates multiple real-world constraints and provides 12 instances with 38 to 53 items, alongside baseline solutions from D-Wave's hybrid solver.
Key insights
- Current quantum hardware necessitates specialized benchmarks that balance realistic problem complexity with device tractability to foster advancements in quantum optimization research.
- Integrating a comprehensive set of real-world constraints into 3dBPP instances creates a more accurate and challenging testbed, making optimization algorithms developed on them more relevant to industrial applications.
- The provision of a standardized, openly accessible benchmark with baseline results enables robust scientific comparison, promotes replicability, and accelerates progress in quantum and hybrid optimization techniques for complex logistical challenges.
Summary by alphaXiv.
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