Reproduce “Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack” on OpenResearch

Turn your favorite coding agents into research agents that review literature, develop hypotheses, and run experiments.

Universal app for Apple silicon and Intel. Requires macOS 11 or later.

About this paper

Mohammad Elahi, Max O. Bloomfield, Theodorian Borca-Tasciuc, Jacob S. Merson

Tip: change arxiv.org to autoarxiv.org in any arXiv abstract link to open the paper here.